AMD announces that its 6th generation EPYC processor 'Venice' will be manufactured using TSMC's 2nm process

by Advanced Micro Devices, Inc.

On April 14, 2025, AMD announced that its 6th generation EPYC processor, Venice , will be manufactured on TSMC's 2nm process (N2) node. This was made possible through a partnership with TSMC, making it the industry's first HPC (high performance computing) product manufactured using TSMC's 2nm process.

AMD Achieves First TSMC N2 Product Silicon Milestone :: Advanced Micro Devices, Inc. (AMD)

We're proud of our deep partnership with TSMC, and we know the need for compute will continue to grow, which is why we're excited to announce several updates... 🧵

pic.twitter.com/QM4FUZuVZ4

— AMD (@AMD) April 14, 2025

AMD teases its first 2nm chip, EPYC 'Venice' fabbed on TSMC N2 node — also announces USA production of current-gen chips | Tom's Hardware
https://www.tomshardware.com/pc-components/cpus/amds-first-2nm-chip-is-out-of-the-fab-epyc-venice-fabbed-on-tsmc-n2-node

The Venice is AMD's 6th generation server CPU 'EPYC' and will be manufactured at TSMC's N2 node. It is said to be the first HPC design manufactured on TSMC's 2nm process, but details have not been disclosed.

AMD is announcing that its next-generation AMD EPYC processors will be the industry's first HPC products built on TSMC's cutting-edge 2nm (N2) process technology. This demonstrates the strength of AMD and TSMC's semiconductor manufacturing partnership as they work together on new design architectures.

The Venice is scheduled to be released in 2026.

In addition to announcing its partnership with TSMC, AMD also announced that it has successfully deployed and tested its 5th Generation EPYC CPUs at TSMC's Arizona factory, Fab 21.

Regarding 'Fab 21,' it is reported that 'chip production using the 4nm process will begin' in January 2025.

TSMC's Arizona factory 'Fab 21' starts production of 4nm semiconductors, with yield and quality equivalent to Taiwan factory - GIGAZINE

'TSMC has been a valued partner for many years, and our deep collaboration with their research, development and manufacturing teams has enabled AMD to consistently deliver leading-edge products that push the boundaries of high-performance computing,' said Lisa Su, AMD chairman and CEO. 'The fact that we are a leading HPC customer for TSMC's N2 process and Fab 21 is a great example of how we are working closely together to drive innovation and deliver advanced technologies that support the future of computing.'

'TSMC is proud to have AMD as a key HPC customer for our advanced 2nm process technology and Fab 21,' said CC Wei, chairman and CEO of TSMC. 'Together, our companies are driving significant technology scaling by improving the performance, power efficiency and yield of high-performance silicon. We look forward to continuing to work closely with AMD to enable the next era of computing.'